1. Dedicated Solutions for the Electronics and Semiconductor Industry

• Nanometer-level particle removal: Capable of removing aluminum oxide particles ≥0.5μm, with a residue rate <0.1 particles/mm² (superior to IPC-A-610E standards);
• Non-destructive cleaning process: Through power ramping technology (0-100% power climb time ≤15s), it avoids edge cracking of silicon wafers caused by cavitation impact, increasing the yield rate to 99.2%.

2. Full-process Cleaning for Hardware Machining

• Degreasing process: At a frequency of 40kHz and a power of 1000W, cutting fluid residues are removed within 30 minutes (removal rate >99%);
• Derusting process: Combined with ultrasonic derusting agents, cleaning at room temperature (25°C) can peel off the Fe3O4 oxide layer, reducing chemical usage by 70% compared to traditional pickling;
• Polishing assistance: With emery abrasives, high-frequency vibration achieves a surface roughness of Ra0.2μm, replacing 80% of manual polishing workload.

3. Deep Cleaning for Medical and Daily Chemical Industries

• Medical device pretreatment: Supports a 134°C high-temperature sterilization mode (requires optional heating module), with microbial count <5CFU per piece after cleaning, meeting the WS 310.2-2016 disinfection supply standards;
• Beauty tool cleaning: For porous materials such as makeup brushes and powder puffs, low-frequency pulsed cleaning (20kHz+300W) removes residual cosmetic oils within 3 minutes, with a bacterial removal rate >99.9%.